Wire Bonding

Wire bonding is the most common technique to electrically connect the pads of a die with the leadframe, the circuit board or the housing. We offer gold wire bonding (22 to 75 μm) and aluminium wire bonding (25 μm). Both bonders are semi automatic tools. Our know-how includes US ball-wedge (Fig. 2) and wedge-wedge (Fig. 3) bonding on conventional PCB-coatings of Ni and gold (ENIG = Electroless Nickel Immersion Gold) and customised coatings like AlSi2%, Ag/Au, Ag and Cu (to a limited extent only). With our equipment we are able to reach ball pad pitches (BPP) of down to 65 μm (Fig. 1). Furthermore we offer the fabrication of stud bumps for Flip Chip applications. Fig. 4 shows a fully bonded Chip-on-Board assembly.

The main characteristics of wire bonded products are low resistive, ohmic contacts and a durable mechanical joint. The mechanical integrity of the wire bonds are determined using pull and shear tests.

Fig. 1: Ball on pad with a BPP of 65 microns
Fig. 2: Ball on a pad
Fig. 3: Wedge
Fig. 4: Chip-on-Board assembly (COB)