Die bonding is a common technique to assemble circuit boards and housings. Micromechanical and microelectronic components are aligned to the carrier and bonded via Flip-Chip technology. Thus the components can be hermetically encapsulated. The bonding techniques include ultrasonic welding, thermo-compressive bonding, soldering and dispensing of electrically conducting adhesives. To assure mechanical stability and endurance of the Chip-on-Board assembly (COB) the application of an underfill (low viscosity adhesive) or glob-top is possible.