Dicing is a common technique in microelectronics to separate dies from a substrate. A high throughput, low wear of the blade and the quality of cut are of primary interest. Damages along the cutting line are especially unwanted. This so called chipping typically occurs with brittle material with a low fracture strength (e.g. materials with  low plastic deformation characteristics). There are various factors having an impact on the dicing results including choice of dicing blade (grain size, concentration, blade thickness, blade diameter, matrix material), dicing parameters (rotation speed, feed rate, cooling) and way of mounting (foil, wax, etc.).

Fig. 1 shows a dicing line on a silicon substrate where chipping on both sides (front and back) was almost completely eliminated. Fig. 2 shows the a cut through a wafer stack consisting of a 1mm thick silicon wafer and a 0.5mm thick glass substrate.

Typical materials suited for dicing are: silicon, various thin glasses (float glass, BF33, AF45, D263, etc.), alumina, metals, PCB, and other on request.

Fig. 1: Diced silicon substrate (0.5mm thickness) almost without chipping
Fig. 2: Diced wafer stack consisting of 1mm silicon and 0.5mm glass substrate without chipping.