The link between the micro and the macro world
Integrated circuit packaging is a well known discipline in the field of microelectronics. Its processes can be transferred to MEMS products. Unlike ICs microtechnical systems (sensors and actuators, MEMS, MOEMS) usually need a direct contact to their environment to detect physical (or chemical) parameters. At the same time other disturbing influences must be minimised. These are the main topics of MEMS packaging (abbr. packaging).
Typical examples for packaging are:Electrical feed-throughHermetic encapsulationMechanical integrity Furthermore the packaging is concerned with the design of customised solutions like electrical, mechanical fluidic and/or optical interfaces. The main focus is on functionality and compatibility with existing industrial processes.
We offer processes and know-how in the following fields:
- Thermo-compressive Bonding
- Eutectic Bonding
- Anodic Bonding
- Glas Frit Bonding
- Adhesive Bonding
- Screen Printing
- Wafer Dicing