Packaging Technologies

  • Packaging

Typical Applications

  • Bonding of two or more substrates (anodic, eutectic, thermo-compressive)
  • Hermetic encapsulation with optional electrical vias
  • Screenprinting of solder pastes and glass frits
  • Wafer dicing
  • High precision die bonding of mirco parts
  • Wire or flip-chip bonding for electrical connections
  • Encapsulation of micro parts
Dip Pen Nanolithographie (DPN) Device
Dip Pen Nanolithography (DPN) Device