Wire Bonder Delvotec 5630

Working Area:Up to 100 x 100 mm2
Resolution:0.25 µm
Repeatability:< 2 µm
Speed:≤ 30 Wires/min
Wire Material:Aluminum
Bond Head:Wedge-Wedge with ±360° Rotation Axis
Wire Size:25 µm
Manufacturer:F&K Delvotec Semiconductor GmbH
Wire-Bonder Delvotec
[Translate to en:] Wire-Bonder Delvotec