Wafer Dicer Accretech SS30

Substrate Size:Round up to Ø300 mm, □ up to 300x250 mm2
Spindle Rotation:up to 60000 rpm
Cutting Speed:bis 300 mm/s
Y-Accuracy:0.002mm/310mm
Z-Repeatability:0.001 mm
Materialis:Silicon, Glass, Ceramics, Sapphire
Monitoring:Blade Wear, Kerf check during cutting process
Dressing:Possible during cutting process
Special Features:Chop Cut
Main Application:Separation of single dies (chips) from the wafer