PVD Sputtering Tool BAS 450

DC magnetron sputtering:Electrically conducting materials
RF sputtering:Highly resistive or non-conducting materials
Materials:Al, Ti, Cr, Au, W/Ti, Cu, TaSi, Si, Ag, Al/Si, other materials on request
Substrate sizes:∅ 100 mm, max. 120x250 mm2
9 Pcs/Run
Process gases:Ar, N2, O2 (reactive sputtering)