PVD Evaporation Tool BAK 600

Evaporation:Various materials via e-beam or thermal heating
Preprocessing:Surface activation/ cleaning with O2 glow discharge possible
Materials:Cu, Au, Ag, Ti, Cr, Ta, Pt, Al, Ni, SiO2, Al2O3, Si, Nb
Substrate sizes:100 mm wafers max. 18 pcs/run, 150 mm wafers max. 4 pcs/run, 200 mm wafers max. 3 pcs/run, non-standard substrates with flexibel mounting on calotte
Substrate materials:Glass, silicon, metals, ceramics, polymers (on request)