Infrastructure

The MNT operates over 600 m2 of cleanroom facilities (ISO 5-7) in which various prosessing tools are located. The spectrum of processes at the institute range from thin film coating (PVD, CVD, electro plating) to photolithography, etching (wet and dry etching), and packaging (bonding techniques, dicing, die and wire bonding).

The infrastructure is optimized for microsystems, e.g. micromechanical components like sensors and actuators (MEMS/MOEMS).