Bonding technology on substrate (wafer) level

The bonding technology is an essential process step when encapsulating sensors and actuators or assembling systems consisting of several substrates. It determines the yield, functionality, long-term stability and life-time of the product.

The MNT offers a wide variety of bonding technologies enabling the joining of various materials:

Our services include the analysis of bonded interfaces as well as suitable test procedures to determine the joints. Mechanical test methods include:

  • Micro Chevron Test to determine the fracture strength and binding energy according to the SEMI Standard MS5-1211, and
  • Shear strength test to determine the maximum shear strength

Leakage rates of hermetic cavities predict the probable lifetime of a product. Those tests are done according to MIL-STD-883.